YAMAHA VP-01G-Y 3D Solder Paste Inspection Machine

The latest inline solder-paste inspection system, the VP-01G-Y, with advanced features to raise surface-mount production quality and productivity.

Consolidating high-speed and high-resolution inspection capabilities in a single unit, the VP-01G-Y uses advanced algorithms in 2D and 3D modes to aid focusing and contour extraction.

Analysis includes 3D solder-paste and adhesive inspection, foreign-matter detection, and board warpage, to assist screen-printing, dispensing, and component-placement processes.

The system compensates for board warping and handles inspection of flexible PCBs. Advanced features include a ring light source that provides 360° illumination to ensure reliable inspection and accurate three-dimensional measurements.