These electronic potting and encapsulation compounds are fast curing two part epoxy resins of low viscosity. ER1450 cures as an opaque white resin, while ER1451 exhibits the same properties but has an optically clear finish. Both resins exhibit exactly the same physical properties. They are tough but fast curing systems which show

Electrolube ER2001 is a general purpose epoxy potting compound designed primarily for use where UL94 V-0 flame retardant properties are required. The resin has been formulated with improved flame retardant fillers to produce a material with relatively low toxicity fumes and low smoke emission. ER2001 is easy to mix and

ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity system ideal for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is required. It has a

ER2188 two part epoxy is a flame retardant, general purpose potting and encapsulating compound. Its a good all round resin offering a cost effective solution for a wide range of applications. The system utilises a hardener free of DDM or other aromatic amines. The flame retardant technology used is of a

ER2219 is a versatile single component epoxy resin suitable for use as a glob-top resin or for dipping hybrid circuits and individual components which require discrete concealment. The resin is semi-thixotropic allowing for efficient heat curing and a faster process time. ER2219 meets UL94 V-0 approval as a flame retardant resin.

ER2220 is a flame retardant, thermally conductive, two part encapsulation compound based on epoxy technology. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal conductivity when compared to traditional thermally conductive encapsulants. Combined with flame retardance achieving UL94 V-0 level, ER2220

ER2223 black epoxy resin has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It has excellent chemical resistance, including most fluids found in the engine compartment of vehicles or other mechanical applications offering superb protection to electronic components.

ER2224 Epoxy potting compound is a highly thermally conductive resin (1.0 W/m*K) which also offers strong thermal cycling properties. It is an off-white resin allowing it to blend with LED designs, dissipating heat from the LED and extending the units operating lifetime and reliability while offering excellent environmental protection against