Fully automatic spray-in-air closed loop zero drain system. Multiple platform configuration. Superb for cleaning high volume of electronic assemblies.
Application
Defluxing – removing all kinds of solder residues
Cleaning of micromechanical components
Removing contamination from handling and board manufacturing, FOD
Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, BTC, QFN, MELF
Cleaning of power electronics
For electronic assemblies requiring extra short process time
Ideal for second side misprints on complex assemblies
Cleaning before conformal coating and wire bonding