The Spectrum II Premier system from Nordson ASYMTEK improves upon the world’s preferred automated fluid dispensing platform (Spectrum II) with the latest technology to manufacture the most challenging advanced semiconductor packages with applications including wafer-level packaging and underfill dispensing. The Spectrum II Premier incorporates the latest generation IntelliJet jetting system with ReadiSet™ Jet Cartridge technology, taking jetting to new levels. Capable of consistently jetting small volumes as low as 1 nL and frequencies up to 1000 Hz, the IntelliJet system jets into tighter dispense gaps with smaller wet-out distances than traditional jets. ReadiSet cartridges make jet maintenance quick and easy, keeping dispenser productivity at its highest level. The Monocle Vision Package further improves wet-dispense accuracy and productivity with higher contrast capabilities and larger fields of view.
The Spectrum II Premier platform reduces process variation, increases yield, and reduces cost. Software-managed temperature, fluid and air pressure provide closed-loop control that eliminates the need for operator adjustments. Nordson ASYMTEK’s patented Calibrated Process Jetting (CPJ) automatically maintains volumetric repeatability during long production runs. Controlled Process Heat (CpH™) adds recipe-controlled heat management for improved thermal efficiency.
Pairing the performance of the Spectrum II Series advanced process controls with the IntelliJet system provides unmatched consistency for large production lines. Achieving identical performance across a production line and scaling up production rapidly and reliably is easily managed by copying process settings from system to system.
Equipped with the IntelliJet Jetting System
High Resolution Monocle Vision Package
Fids-on-the-Fly software for high-speed fiducial capture
Non-Contact Laser Height Sensor
Calibrated Process Jetting (CPJ)
Dual-Simultaneous and Dual-Action Dispensing – optional
Tilt Dispensing: Single-Axis and Programmable Tilt + Rotate – optional
Dual-lane Dispensing for increased throughput – optional
Pre-/Dispense/Post-heating to enhance underfill flow-out and curing – optional
Multiple Applications (underfill, cavity fill, die attach, precision coating, encapsulation, and more)