YSi-SP / 3D Solder Paste Inspection Machine

Available on backorder

“1-head solution” to perform various inspections with a single head
Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
A thorough and extensive machine-to-machine (M2M) solution
Statistical Process Control (SPC) for diverse statistical processing
Optional features to enable handling various products





Applicable PCBL 510 x W 460 mm to L 50 x W 50 mm (single lane spec)
*No dual lane specification available.
Horizontal resolution (FOV size)25 µm / 12.5 µm (approx. 50 x 50 mm)
20 µm / 10 µm (approx. 40 x 40 mm)
15 µm / 7.5 µm (approx. 30 x 30 mm)
*All are standard selection type.
Height resolution1 µm
Inspection itemsSolder paste printing quality (volume, height, area and misalignment)
Power supplySingle-phase AC 200 V–230 V ±10 %
Air supply sourceAirless specification
External dimensionL 904 x W 1,080 x H 1,478 mm
WeightApprox. 550 kg
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