S20 / 3D Hybrid Modular Mounter

Available on backorder

Production Revolution Ultimate flexibility Color fiducial camera
Enhancement to 3D MID
Max. feeder capacity 180 lanes
Large board handling capability
Wide range component handling capability
CFB/CTF full compatibility






Board size
(with buffer unused)
Min. L 50 x W 30 mm to Max. L 1,830 x W 510 mm (Standard L 1,455)
Board size
(with input and output buffers used)
Min. L 50 x W 30 mm to Max. L 540x W 510 mm
Board thickness0.4 – 4.8 mm
Board flow directionLeft to right (Std)
Board transfer speedMax 900 mm/sec
Placement speed
(12 heads + 2 theta) Opt. Cond.
0.08 sec/CHIP (45,000 CPH)
Placement accuracy A (μ+3σ)CHIP +/- 0.040 mm
Placement accuracy B (μ+3σ)IC +/- 0.025 mm
Placement angle+/- 180 degrees
Z axis control/ Theta axis control
AC servo motor
Component heightMax 30 mm*1 (Pre-placed components: max 25 mm)
Applicable components0201 mm – 120 x 90 mm, BGA, CSP, connector, etc.
Component package8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray
Drawback checkVacuum check and vision check
Screen languageEnglish, Chinese, Korean, Japanese
Board positioningBoard grip unit, front reference, auto conveyor width adjustment
Component typesMax 180 types (8 mm tape), 45 lanes x 4
Transfer height900 +/- 20 mm
Machine dimensions, weightL 1750 x D 1750 x H 1420 mm, Approx. 1450 kg
*1) Board thickness + Component height = Max 30mm
Some specifications and parts of the external appearance are subject to change without notice.
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