Simple BGA rework procedure
BGA rework poses the problem of accessing hidden interconnects in a high density environment. Consequently, it requires a station that is able to access the hidden joints without affecting neighbouring components.A station that is safe, gentle, adaptable and, above all, simple to operate.
The IR-C3 Chipmate is such a station. It is so easy to operate that technicians are able to instantly achieve excellent process control for BGA/SMT rework without the complexities and frustrations normally associated with ‘high end’ rework stations.
The IR-C3’s standard features, with the use of simple aids, operators can simply pick up the BGA, align it, place it into fluxed pads and reflow with the station’s accurate closed-loop component temperature control.
Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system
Quartz IR PCB preheating
2000W, two zone (240mm x 240mm heating area)
Precision Component Pick and Placement
Professional vacuum placement system
Precision PCB Handling
Portable Benchtop PCB workholder
Component Temperature Sensing
Standard non-contact IR temperature sensor
PCB Temperature Sensing
K-type wire thermocouple
Advanced Thermal Process Control
Digital based auto profile thermal control