1913 MK3 Heller reflow oven

Available on backorder

The ultimate high volume Surface Mount Technology production solution with belt speeds up to 1.4m/min to accommodate the fastest pick-and-place systems delivering the highest levels of repeatability with the lowest delta Ts.
Highest Yields and Tight Process Control
The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.
Wide process window for “universal profiling” – allows many different boards to be run on a single temperature profile
Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.
With a high-capacity, 26-inch wide heater module, the 1900 Mark III Series offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo, to carry even the largest boards or multi-board panels (up to 20 inches wide) through the oven.


Advancements like the invention of the first waterless / filterless flux separation system earned Heller the prestigious Vision Award for Innovation in soldering. But more importantly, this development extended preventative maintenance intervals from weeks to months.
Now, the latest breakthroughs associated with the MK III reflow system provide even lower cost-of-ownership for our customers. The new heating and cooling technologies deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK III system not only the premier soldering system but the best overall value in the industry!

New Flux System Virtually Eliminates Maintenance

This new flux collection system traps the fl ux in a separate collection box with easy to remove plates. As a result, the oven tunnel is kept clean – thus saving time consuming P.M. A collection jar captures the fl ux and can be removed while the oven is running for the ultimate in time savings!

Ultra-Parallel Conveyor System

Four (4) lead screws ensures the tightest tolerances and parallelism – even on boards with 3mm clearance at the edges!

Enhanced Heater Modules

Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards! Additionally, the Uniform Gas Management system eliminates net flow which results in nitrogen consumption reductions of up to 40%!

Fastest Cooling Rates

The new Blow Thru Cooling module provides cool rates of >3º C/sec – even on LGA 775! That rate meets even the most demanding lead-free profile requirements!

New Frame
More than simply beautiful, this new frame utilizes twice the insulation. This modification alone, reduces heat loss and saves up to 40% on electricity costs!

Lead Free Certified
More Lead free product has been run on Heller machines than any other! Heller has pioneered the Lead Free Reflow process by working closely with the Japanese OEM’s and International ODM’s and EMS’s to refine the Lead Free process. The Mark III system includes features that provide:
“Spike Zone” design to minimize liquidous time
Ultra fast cooling rates of 3-5 Deg/Sec to form perfect grain structure
More heated zones than any other competitor to allow “Profile Sculpting”

Lowest Cost of Ownership
With Heller’s Balanced Flow Heater Module (BFM) technology the cost of running nitrogen has been reduced by up to 50%! And the LOW KW features have reduced Electrical consumption by up to 40%! Cost savings on nitrogen and electricity combined of $15,000 – $18,000 per year have been realized by our customers!

Best Return on Investment (ROI)
Total savings of $22,000 – $40,000 per year can be achieved with the new Mark III system for the fastest ROI in the industry!

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