Novo™ Series: Model 300

Available on backorder

MicroDrop drop-jet fluxer
Nitrogen preheating
All titanium solder pot and pump assembly
Quick change magnetically coupled solder nozzle
TFT monitor
PhotoScan editor and machine control software:
Easy “point-and-click” programming
Remote machine control
Remote machine maintenance
Network and FIS capability


Features and Benefits
Standalone platform idea for prototype, cell manufacturing or small batch production requirements
Entry level selective soldering with compact footprint requiring less than 1.1 square meters of factory floor space
Full titanium solder pot compatible with all solder alloys plus easy tool-free maintenance
Modular platform design allows options to be added as application needs change
Entry level selective soldering system with capability to solder printed circuit boards at the same speed as larger or expensive machines
Designed for a wide variety of selective soldering applications, the Novo™ 300 offers exceptional value with superior process capabilities and is ideal for prototype, small batch production or cell manufacturing. The Novo™ 300 has many unique features, including drop-jet fluxing, IR preheating and selective soldering with fast and easy programming and machine setup.

With its compact form, single drop-jet fluxer and all titanium solder pot, the Novo™ 300 is a versatile selective soldering platform and has a soldering area of 300 x 300 mm. The Novo™ 300 can also process printed circuit boards as large as 500 x 300 mm (19.6 x 11.8 in.).

With a reputation for innovation, comprehensive process solutions from Nordson SELECT ensure a maximum return on investment and low cost of ownership. From initial process development through full-scale production, you are supported by our experienced worldwide engineering, applications development and technical service network.

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