SLC/BLC vapor phase oven

Available on backorder

Powerful unit for highest demands
Different machine types with carrier sizes from 300 x 340 x 80 mm up to 840 x 540 x 80 mm
Small footprint
Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
Easy one step profile set-up with Intelligent profiling system (IPS)
Wide variety of adjustable solder profiles
Lead-free and leaded soldering on one machine with one fluid
Live temperature monitoring with IBL Software (VP- Control) without profiler
Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
Low maintenance due to Cool Handling (all moving parts outside process chamber)
Maintenance-free transport system (patented)
Integrated automatic fluid filter system
Observation window into process chamber
Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts


The Machine The SLC/BLC reflow vapor phase soldering systems (available as batch or inline) are perfect for medium to high volume production. The machines offer highest quality performances with smallest footprints. Many patented features are available and provide a wide range of flexibility

Back to Top