The VAC 745/765 (available as batch or inline) combines the advantages of the vapor phase with the vacuum process and guarantees void-free solder joints with highest quality. The soldering system operates in a completely inert atmosphere during the whole reflow and vacuum process. Many patented features are available and provide a wide range of flexibility. The machine promises oxygenfree soldering an no overheating of components. In addition, the power consumption of the machine is very low.
VAC 745/765 vapor phase oven
Available on backorder
Powerful unit for highest demands
Different machine types with carrier sizes from 300 x 340 x 80 mm up to 840 x 540 x 80 mm
Small footprint
Low energy and fluid consumption with 2-chamber design and integrated heat exchanger
Highest precision and process quality with patented Soft Vapor Temperature Control (SVTC)
Easy one step profile set-up with Intelligent profiling system (IPS)
Wide variety of adjustable solder profiles
Lead-free and leaded soldering on one machine with one fluid
Live temperature monitoring with IBL Software (VP- Control) without profiler
Traceability and documentation with IBL Software (VP-Control) optionally with barcode function
Low maintenance due to Cool Handling (all moving parts outside process chamber)
Maintenance-free transport system (patented)
Integrated automatic fluid filter system
Observation window into process chamber
Optional patented Rapid Cooling System (RCS) for heat reduction of sensitive parts