Advantages compared to other cleaners:
Successfully cleans under low standoff components
Especially effective for lead-free No-Clean solder pastes
High bath loading capacity ensures extended bath life, low maintenance costs and reduced costs per cleaned part
Easy to rinse and does not leave any residues on the surfaces
Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
Optimal flux removal after die attach increases wire bonding quality as well as light conversion and life time of Power LEDs
Vigon A201 PCB cleaner
In Stock
Water-based defluxing agent for spray-in-air cleaning processes.
VIGON® A 201 provides excellent cleaning performance in spray-in-air cleaning processes for the cleaning of capillary spaces, e.g. under low standoff components. It leads to shiny solder joints after cleaning without the need for any additives. Additionally, it is recommended for flux removal from Flip Chips, CMOS and Power LEDs.