HTCPX Non-Silicone Heat Transfer Compound PLUS Xtra

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HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCPX are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

The product contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly soldering problems caused by silicones will not been ecountered.


Approvals RoHS Compliant (2015/863/EU): Yes
Typical Properties Colour: Pale grey
Base: Blend of synthetic fluids
Thermo-conductive Component: Powdered metal oxides
Density @ 20°C (g/ml): 3.1
Cone Penetration @ 20°C: 250
Viscosity @ 1rpm (Pa s): 606-670
Thermal Conductivity (Guarded Hot Plate): 3.4 W/m.K (calculated)
Thermal Conductivity (Heat Flow): 2.3 W/m.K
Temperature Range: -50°C to +180°C*
Weight Loss after 96 hours @ 100°C: <1.0%
Permittivity @ 1GHz: 4.2
Volume Resistivity: 1 x 1014 Ohms-cm
Dielectric Strength: 42 kV/mm
*Application dependent; excursions to higher temperatures may be possible, testing in end-use conditions is advised.
Description Packing Order Code Shelf Life
Heat Transfer Compound Plus – Xtra 700 gram cartridge HTCPX700G 48 months
25 Kg Bulk HTCPX25K 72 months

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