TBS Thermal Bonding System

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Thermal Bonding Compound is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. It is especially useful in the manufacture of heatsink assemblies where ‘piggy back’ arrangements are applied and where the manufacture design of heat sinks does not allow for welding or brazing techniques to be employed due to complexity or geometry of the fins. TBS is also ideal for use as a bonding medium in surface mounting assemblies.


Approvals RoHS Compliant (2015/863/EU): Yes
Typical Properties Colour (Part A): Blue
Colour (Part B): Cream
Viscosity @ 1rpm (Pa s): 70-80
Mix Ratio (A:B): 3:1
Usable Life: 3 to 4 hours
Cure Time: 45 mins @ 100°C
75 mins @ 60°C
8 to 12 hrs @ room temperature – hard
48 hours @ room temperature – full cure
Cured Properties Cured Density (g/ml): 1.85
Thermal Conductivity: 1.1 W/m.K
Operating Temperature Range: -40°C to + 120°C
Deflection Temperature: 100°C
Electric Strength: 11 to 12 kV/mm
Volume Resistivity: 1014 to 1015 Ohms/cm
Tensile Strength: 2200N/cm2
Modulus of Elasticity: 2 to 3 GN/m2
0.29 – 0.435 x 106 lbf/in2
Specific Heat Capacity: 0.5 cal/g/°C @ 30°C – Part A
0.35 cal/g/°C @ 30°C – Part B
Description Packaging Order Code Shelf Life
Thermal Bonding System 20 ml Twin Syringe System TBS20S 36 months
1kg Kit TBS01K 24 months

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