- Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system - Quartz IR PCB preheating
2250W, two zone (240mm x 240mm heating area)
Optional 750W, single zone (120mm x 120mm heating area) - Precision Component Pick and Placement
Professional vacuum placement system - Component Nest/Flux Application Facility
Optional Jaw mounted nest with flux dip tray or component print frame - Precision PCB Handling
Professional PCB table with micro X/Y - Component Temperature Sensing
Standard non-contact IR temperature sensor - PCB Temperature Sensing
K-type wire thermocouple
Optional non-contact IR temperature sensor - Advanced Thermal Process Control
Software based auto profile thermal control - Camera/Prism Based BGA/CSP/QFN
Alignment System (Optional)
Auxiliary process observation camera - Auxiliary Process Camera (Optional)
Auxiliary process observation camera
Top heat power | 150W IR |
Back heater power | 750W or 2250W IR |
Voltage/frequency | 208-240 volts 50/60Hz, up to 3KW |
Typical components | CSPs, BGAs, uBGAs, QFNs, QFPs, PLCCs, SOICs, small SMDs |
Bench area | 1400mm (w) x 600mm (d) |
Weight | 65 Kg |