- Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system - Quartz IR PCB preheating
E6S – 3000W, three zone (360mm x 240mm heating area)
E6 XL – 3200W, three zone (500mm x 240mm heating area) - Precision Component Pick and Placement
Advanced Professional vacuum placement system - Component Nest/Flux Application Facility
Integrated nest with flux dip tray or component print frame - Precision PCB Handling
Advanced Professional PCB table with macro-micro X/Y - Component Temperature Sensing
Standard non-contact IR temperature sensor - PCB Temperature Sensing
Standard non-contact IR temperature sensor - Advanced Thermal Process Control
Software based auto profile thermal control - Camera/Prism Based BGA/CSP/QFN Alignment System
Split beam prism system for simultaneous PCB/component viewing - Auxiliary Process Camera (Optional)
High magnification camera and LED lighting - Forced Air PCB Cooling (Optional)
Highly effective, integral PCB cooling with air knife system
| Top heat power | 150W IR |
| Back heater power | 3200W, 2 Zone, 2 x 16700W |
| Voltage/frequency | 208-240 volts 50/60Hz, up to 3KW |
| Typical components | CSPs, BGAs, uBGAs, QFNs, QFPs, PLCCs, SOICs, small SMDs |
| Bench area | 2000mm (w) x 1000mm (d) |
| Weight | 100 Kg |