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Removes misprinted adhesives and pastes before they cure and attach themselves to screens or PCBs Strong, yet non-destructive cleaning product Fast evaporating Odour-free Ideal accompaniment to in-line cleaning systems where adhesives are dispensed Available in 500ml spray bottles and 5L fluid containers
Water-based, single-phase stencil cleaner HYDRON® SC 300 is a water-based, single-phased cleaning agent for SMT stencils at room temperature. It reliably removes solder pastes and especially SMT adhesives in one single process and does not leave any adhesive pigment residues. The cleaning agent is recommended for cleaning and rinsing and dries
Formulated specifically for the removal of stencil contaminants Extremely effective on solder paste residue Removes contaminants cleanly and without scouring the stencil surface Odour-free and evaporates quickly to leave surfaces clean and dry Typical uses include: under-screen cleaning, misprinted PCBs, spatulas, printer interiors Available in 500ml spray bottles and 5L fluid containers
Stencil cleaner for the removal of solder pastes and SMT adhesives. VIGON® SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in
For the removal of solder pastes, SMT adhesives and fluxes VIGON® SC 202 is a water-based cleaning agent designed for the reliable removal of solder pastes and SMT adhesives from stencils. Based on the MPC® Technology, this medium has also been developed to clean double-sided misprints, with one side already soldered.
For the removal of solder pastes and SMT adhesives VIGON® SC 210 is a water-based cleaning agent specifically developed to clean SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives in a single process and provides optimum cleaning results even at low temperatures starting from 18°C/64°F. VIGON® SC 210 is
Cleaning medium for stencils and screens ZESTRON® SD 100 is a solvent-based cleaning agent used to remove solder paste from SMT stencils in spray-in-air equipment. Misprinted assemblies can also be cleaned with ZESTRON® SD 100.
For the removal of solder pastes, SMT adhesives and thick film pastes ZESTRON® SD 301 is an odor improved formulation. Especially a faster drying time allows for shorter cleaning processes. The solvent-based cleaner removes solder pastes, SMT adhesives as well as thick film pastes from stencils and screens in spray-in-air systems.