| Model | S20 |
| Board size (with buffer unused) | Min. L 50 x W 30 mm to Max. L 1,830 x W 510 mm (Standard L 1,455) |
|---|---|
| Board size (with input and output buffers used) | Min. L 50 x W 30 mm to Max. L 540x W 510 mm |
| Board thickness | 0.4 – 4.8 mm |
| Board flow direction | Left to right (Std) |
| Board transfer speed | Max 900 mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08 sec/CHIP (45,000 CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/- 0.040 mm |
| Placement accuracy B (μ+3σ) | IC +/- 0.025 mm |
| Placement angle | +/- 180 degrees |
| Z axis control/ Theta axis control | AC servo motor |
| Component height | Max 30 mm*1 (Pre-placed components: max 25 mm) |
| Applicable components | 0201 mm – 120 x 90 mm, BGA, CSP, connector, etc. |
| Component package | 8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 180 types (8 mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20 mm |
| Machine dimensions, weight | L 1750 x D 1750 x H 1420 mm, Approx. 1450 kg |
| *1) Board thickness + Component height = Max 30mm Some specifications and parts of the external appearance are subject to change without notice. | |
S20 / 3D Hybrid Modular Mounter
Available on backorder
Production Revolution Ultimate flexibility Color fiducial camera
Enhancement to 3D MID
Max. feeder capacity 180 lanes
Large board handling capability
Wide range component handling capability
CFB/CTF full compatibility
Enhancement to 3D MID
Max. feeder capacity 180 lanes
Large board handling capability
Wide range component handling capability
CFB/CTF full compatibility