Advantages compared to other cleaners:
High bath loading capability of ZESTRON® FA+ ensures extended bath life
The cleaning medium does not require any specific explosion-proof environment
Due to the surfactant-free formulation, ZESTRON® FA+ can be easily rinsed
Increased wire bonding/molding quality for power modules, leadframe-based discrete components and Power LEDs
Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
ZESTRON® FA+ has been EMPF Phase II tested and MIL approved
This cleaning medium is listed in the ESA “list of declared materials”
Zestron FA+ PCB cleaner
In Stock
Solvent for defluxing in semi-aqueous processes
Solvent-based cleaning agent designed to remove all types of flux residues from electronic assemblies, ceramic hybrids, power electronics (power modules, leadframe-based discrete components, power LEDs) and packages (Flip Chips(CMOS). The product is characterized by its high cleaning performance and bath loading capability ensuring an extremely long bath life.