Approvals RoHS Compliant (2015/863/EU): Yes
UL Approval: No
Liquid Properties: Base Material Epoxy
Density Part A – Resin (g/ml) 1.11
Density Part B – Hardener (g/ml) 0.96
Part A Viscosity (mPa s 23°C) 250
Part B Viscosity (mPa s 23°C) 300
Mix Ratio (Weight) 2.51:1
Mix Ratio (Volume) 2.17:1
Mixed System Viscosity (mPa s 23°C) 200
Usable Life (20°C) 20 minutes
Gel Time (25°C) 30 minutes
Cure Time (25 °C) 12 hours
Cure Time (50 °C) 2 hours
Cure Time (80 °C) 30 minutes
Colour Part A – Resin White
Colour Part B – Hardener Amber
Storage Conditions Dry Conditions: Above 15ºC, Below 35ºC
Shelf Life 12 Months (Resin packs – 18 months)
Cured System: Cured Density (g/ml) 1.10
Temperature Range (°C) -50 to +130
Max Temperature Range (Short Term (°C)/30 Mins)
(Application and Geometry Dependent) +150
Dielectric Strength (kV/mm) 12
Volume Resistivity (ohm-cm) 1014
ER1450/ER1451 White / Clear Epoxy Resin
In Stock
These electronic potting and encapsulation compounds are fast curing two part epoxy resins of low viscosity. ER1450 cures as an opaque white resin, while ER1451 exhibits the same properties but has an optically clear finish.
Both resins exhibit exactly the same physical properties.
They are tough but fast curing systems which show good results through thermal cycling and offering stability in applications with variable temperature while maintaining good electrical properties and a good adhesion to a range of substrates.
The system may be supplied in bulk, kit or resin pack form.