The PDR IR-E3 is a high powered system, available with a multi-zone 2250W, 2800W or 3050W PCB preheater and is designed to rework SMD / BGA / uBGA / QFN / LEDs on small to medium-large PCB assemblies with upto a 18″/450mm PCB capacity. It is loaded with advanced features delivering many benefits including the highest performance and soldering quality available anywhere, yet it remains simple to set up and use.
The IR-E3 system is now available in 3 models – the E3S, E3G and E3M. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-E3 is our top selling system and one of the best performing BGA Rework Stations worldwide.
Advanced Focused IR component heating Dual-band Visible IR Heating system 150W, lens based Focused IR heating with adjustable image system Ø4-70mm
Quartz IR PCB preheating E3S – 2250W, two zone (240mm x 240mm heating area) with 750W Micro-PCB Thermo Boost E3G – 3050W, three zone (360mm x 240mm heating area) with 750W Micro-PCB Thermo Boost E3M – 3050W, three zone (360mm x 240mm heating area) with 750W Micro-PCB Thermo Boost
Precision Component Pick and Placement Advanced Professional vacuum placement system Soft-touch component landing
Component Nest/Flux Application Facility Integrated nest with flux dip tray or component print frame and optional Optical assist
Precision PCB Handling Advanced Professional PCB table with macro-micro X/Y
Component Temperature Sensing Standard non-contact IR temperature sensor
PCB Temperature Sensing K-type wire thermocouple Optional non-contact IR temperature sensor
Advanced Thermal Process Control Software based auto profile thermal control
Camera/Prism Based BGA/CSP/QFN Alignment System Split beam prism system for simultaneous PCB/component viewing High mag camera-lens optics
Auxiliary Process Camera (Optional) Auxiliary process observation camera Ultra-high mag camera-lens optics
PCB Cooling (Optional) Highly effective, integral PCB cooling with air knife system
