IR-E3 Evolution BGA rework station PDR

In Stock

The PDR IR-E3 is a high powered system, available with a multi-zone 2250W, 2800W or 3050W PCB preheater and is designed to rework SMD / BGA / uBGA / QFN / LEDs on small to medium-large PCB assemblies with upto a 18″/450mm PCB capacity. It is loaded with advanced features delivering many benefits including the highest performance and soldering quality available anywhere, yet it remains simple to set up and use.

The IR-E3 system is now available in 3 models – the E3S, E3G and E3M. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-E3 is our top selling system and one of the best performing BGA Rework Stations worldwide.

  • Advanced Focused IR component heating
    Dual-band Visible IR Heating system
    150W, lens based Focused IR heating with adjustable
    image system Ø4-70mm
  • Quartz IR PCB preheating
    E3S – 2250W, two zone (240mm x 240mm heating area)
    with 750W Micro-PCB Thermo Boost
    E3G – 3050W, three zone (360mm x 240mm heating area)
    with 750W Micro-PCB Thermo Boost
    E3M – 3050W, three zone (360mm x 240mm heating area)
    with 750W Micro-PCB Thermo Boost
  • Precision Component Pick and Placement
    Advanced Professional vacuum placement system
    Soft-touch component landing
  • Component Nest/Flux Application Facility
    Integrated nest with flux dip tray or component
    print frame and optional Optical assist
  • Precision PCB Handling
    Advanced Professional PCB table with macro-micro X/Y
  • Component Temperature Sensing
    Standard non-contact IR temperature sensor
  • PCB Temperature Sensing
    K-type wire thermocouple
    Optional non-contact IR temperature sensor
  • Advanced Thermal Process Control
    Software based auto profile thermal control
  • Camera/Prism Based BGA/CSP/QFN
    Alignment System 

    Split beam prism system for simultaneous
    PCB/component viewing
    High mag camera-lens optics
  • Auxiliary Process Camera (Optional)
    Auxiliary process observation camera
    Ultra-high mag camera-lens optics
  • PCB Cooling (Optional)
    Highly effective, integral PCB cooling with air
    knife system
Top heat power150W IR
Back heater power2250-3050W IR
Voltage/frequency208-240 volts 50/60Hz, up to 3KW
Typical componentsSMD, BGA, uBGA, QFN, LED, uLED, 0201 etc.
Bench area1400mm (w) x 600mm (d)
Weight65 Kg
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