Showing 161–171 of 171 results
Categories: Stencil cleaning fluids
Vigon SC200 stencil cleaner
Stencil cleaner for the removal of solder pastes and SMT adhesives.
VIGON® SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in
Categories: Stencil cleaning fluids
Vigon SC202 stencil cleaner
For the removal of solder pastes, SMT adhesives and fluxes
VIGON® SC 202 is a water-based cleaning agent designed for the reliable removal of solder pastes and SMT adhesives from stencils. Based on the MPC® Technology, this medium has also been developed to clean double-sided misprints, with one side already soldered.
Categories: Stencil cleaning fluids
Vigon SC210 stencil cleaner
For the removal of solder pastes and SMT adhesives
VIGON® SC 210 is a water-based cleaning agent specifically developed to clean SMT stencils. The cleaning agent reliably removes solder pastes and SMT adhesives in a single process and provides optimum cleaning results even at low temperatures starting from 18°C/64°F. VIGON® SC 210 is
Categories: PCB cleaning fluids
Vigon US PCB cleaner
Water-based agent for flux removal in ultrasonic dip tanks
VIGON® US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC® Technology, VIGON® US removes all types of flux residues from electronic assemblies, Flip Chip Packages and CMOS.
WBP / WBPs Aquacoat Plus
Aquacoat Plus is a clear transparent water based conformal coating, based on polymeric materials which has been specifically formulated for the protection of electronic circuitry. It offers an excellent blend of both physical and electrical properties whilst eliminating the need for extraction and other precautions associated with the application of
Categories: USC rolls
YAMAHA screen cleaning rolls
YAMAHA Cleaning Screen Rolls are made from a non-woven, extra strength material
Excellent wetting characteristics
Ideal for absorbing paste, solvents and adhesives
Convert this material to suit a variety of stencil printing machines
Super high absorbency
High durability
Versatile in wide range of wiping applications
Low linting and particle generation
Categories: Maintenance cleaning fluids
Zestron ES 200 adhesive remover
Strong adhesive remover for ultrasonic applications
ZESTRON® ES 200 is a modified alcohol cleaning agent designed to remove epoxies (SMT adhesives and conductive adhesives) from tools (particularly dispensing needles) and electronic manufacturing substrates in ultrasonic cleaning equipment.
Categories: PCB cleaning fluids
Zestron FA+ PCB cleaner
Solvent for defluxing in semi-aqueous processes
Solvent-based cleaning agent designed to remove all types of flux residues from electronic assemblies, ceramic hybrids, power electronics (power modules, leadframe-based discrete components, power LEDs) and packages (Flip Chips(CMOS). The product is characterized by its high cleaning performance and bath loading capability ensuring an extremely
Categories: Stencil cleaning fluids
Zestron SD100 stencil cleaner
Cleaning medium for stencils and screens
ZESTRON® SD 100 is a solvent-based cleaning agent used to remove solder paste from SMT stencils in spray-in-air equipment. Misprinted assemblies can also be cleaned with ZESTRON® SD 100.
Categories: Stencil cleaning fluids
Zestron SD301 stencil cleaner
For the removal of solder pastes, SMT adhesives and thick film pastes
ZESTRON® SD 301 is an odor improved formulation. Especially a faster drying time allows for shorter cleaning processes. The solvent-based cleaner removes solder pastes, SMT adhesives as well as thick film pastes from stencils and screens in spray-in-air systems.
Categories: PCB cleaning fluids
Zestron VD PCB cleaner
Solvent for water-free defluxing in one-chamber processes with vacuum distillation
Solvent-based cleaning agent designed to remove flux residues from electronic assemblies, ceramic hybrids and leadframe-based discrete components in closed-loop, one chamber, vapor degreasing type systems.