Showing 113–128 of 171 results
SC2001 Heat Cured Silicone Resin
Approvals RoHS Compliant (2015/863/EU): Yes
Typical Properties
UL Approval: Meets UL94 V-0
Liquid Properties: Base material Silicone
Appearance Part A Black liquid
Appearance Part B White liquid
Density Part A (g/ml) 1.4
Density Part B (g/ml) 1.4
Viscosity Part A (mPa s 23°C) 4000
Viscosity Part B (mPa s 23°C) 3000
Viscosity (Mixed System) (mPa s 23°C) 3500
Mix Ratio (Weight)
SC3001 Optically Clear Silicone Resin
SC3001 is an optically clear silicone resin ideal for LED potting and encapsulation due to its clarity when cured and its resistance to UV light and yellowing. Its a flexible two part resin system with a low viscosity making application easy and is particularly suited to applications where thin films are
SC4003E General Purpose Silicone Potting Compound
SC4003E is a two-part silicone potting and encapsulating resin designed for the protection of electronic devices. It has excellent high temperature properties, suitable for use in applications where the operating temperature will be up to 200°C. As with other silicone potting compounds it is soft and flexible offering protection to
SCTP Surface cure thermal paste
SCTP is a thermal interface material for use where the efficient thermal coupling of electrical components is required. It is specially designed to resist pumping out from the bond line and can be applied using industrial dispensing equipment or via screen/stencil printing techniques.
Categories: DISCOUNTED PRODUCTS, Material/consumables, PCB finishes, Soldering consumables, Thermal management
Silver Conductive Paint (on Stock)
Silver Conductive Paint, SCP, provides a thin, smooth, adherent, flexible film of high electrical conductivity on a wide range of substrates.
Categories: Needles
Stainless Steel Plastic Hub Dispensing Needles
The KDS steel needle series consist of a stainless-steel shaft with a double helix polypropylene hub.This premier line of dispensing needles is burr-free,and electro-polished shaft for unobstructed and consistent material flow.In addition they are silicone and chloride free. Designed to dispense most viscosity fluids and adhesives and safe for use to
Categories: Stencil cleaning fluids
Stencil Clean Fluid
Formulated specifically for the removal of stencil contaminants
Extremely effective on solder paste residue
Removes contaminants cleanly and without scouring the stencil surface
Odour-free and evaporates quickly to leave surfaces clean and dry
Typical uses include: under-screen cleaning, misprinted PCBs, spatulas, printer interiors
Available in 500ml spray bottles and 5L fluid containers
Categories: Wipes
Stencil clean wipes
Formulated specifically for the removal of stencil contaminants
Extremely effective on solder paste residue
Removes contaminants cleanly and without scouring the stencil surface
Odour-free and evaporates quickly to leave surfaces clean and dry
Typical uses include: under-screen cleaning, misprinted PCBs, spatulas, printer interiors
Available in tubs of 100 pre-saturated wipes and 100-wipe refill packs
Categories: Wipes
Stencil clean wipes refill pack
Formulated specifically for the removal of stencil contaminants
Extremely effective on solder paste residue
Removes contaminants cleanly and without scouring the stencil surface
Odour-free and evaporates quickly to leave surfaces clean and dry
Typical uses include: under-screen cleaning, misprinted PCBs, spatulas, printer interiors
Available in tubs of 100 pre-saturated wipes and 100-wipe refill packs
TBS Thermal Bonding System
Thermal Bonding Compound is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. It is especially useful in the manufacture of heatsink assemblies where 'piggy back' arrangements are applied and where the manufacture design of heat sinks does not allow
Categories: DISCOUNTED PRODUCTS, Material/consumables, PCB finishes, Soldering consumables, Thermal management
TCER Thermally Conductive Ethoxy RTV
Electrolube TCER is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a wide variety of uses, particularly in automotive
TCOR Thermally Conductive Oxime RTV
Electrolube TCOR is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a wide variety of uses, particularly in automotive
TCP400 Thermally Conductive Putty
TPC400 is a single part dispensable material with high heat transfer performance. The unique formulation means TCP400 can be used on vertical surfaces, it is very soft and exerts low stress on components; the low modulus elastomer shows excellent 'pump-out' resistance and minimal oil bleed. TCP400 can be used as
TFCF Fluorocoat Surface Modifier
TFCF is a unique, fluorinated polymer coating formulated to provide high levels of liquid repellence to printed circuit boards and other electronic devices. Once dried, TFCF forms a thin transparent film of very low surface energy repelling hydrocarbon and silicone oils, synthetic oils and aqueous solutions. The low film strength
TPM350 Thermal Phase Change Material
TPM350 is one of Electrolube's latest high-performance product innovations in our thermal interface material range. It is designed for easy application via screen printing, containing a small amount of solvent which evaporates after application to leave a cured material in place. This eliminates the mess associated with thermal pastes or greases.
TPM550 Thermal Phase Change Material
TPM550 is one of Electrolube's latest high-performance thermal interface material innovations. It is a phase change material meaning that when it reaches its 'activation' temperature of 45°C it changes state to become a lower viscosity material, minimizing the contact thermal resistance and improving the thermal conductivity. Once it cools, it