| Model | YSi-SP |
| Applicable PCB | L 510 x W 460 mm to L 50 x W 50 mm (single lane spec) |
| *No dual lane specification available. | |
| Horizontal resolution (FOV size) | 25 µm / 12.5 µm (approx. 50 x 50 mm) 20 µm / 10 µm (approx. 40 x 40 mm) 15 µm / 7.5 µm (approx. 30 x 30 mm) *All are standard selection type. |
| Height resolution | 1 µm |
| Inspection items | Solder paste printing quality (volume, height, area and misalignment) |
| Power supply | Single-phase AC 200 V–230 V ±10 % |
| Air supply source | Airless specification |
| External dimension | L 904 x W 1,080 x H 1,478 mm |
| Weight | Approx. 550 kg |
YSi-SP / 3D Solder Paste Inspection Machine
Available on backorder
“1-head solution” to perform various inspections with a single head
Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
A thorough and extensive machine-to-machine (M2M) solution
Statistical Process Control (SPC) for diverse statistical processing
Optional features to enable handling various products